Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6350668 | Low cost chip size package and method of fabricating the same | — | 2002-02-26 |
| 6217403 | Gate electrode formation method | Philip J. Elizondo | 2001-04-17 |
| 6181569 | Low cost chip size package and method of fabricating the same | — | 2001-01-30 |
| 6149792 | Row electrode anodization | — | 2000-11-21 |
| 6144144 | Patterned resistor suitable for electron-emitting device | James M. Cleeves, Christopher J. Spindt, Roger W. Barton, Arthur J. Learn, Stephanie Jeanne Oberg | 2000-11-07 |
| 6103095 | Non-hazardous wet etching method | — | 2000-08-15 |
| 6095883 | Spatially uniform deposition of polymer particles during gate electrode formation | Philip J. Elizondo, David Caudillo | 2000-08-01 |
| 6039621 | Gate electrode formation method | Philip J. Elizondo | 2000-03-21 |
| 5967577 | Apparatus for dispensing fluid in an array pattern | Sarvotham Bhandarkar, Tai Chong Chai, Jian-Hua Wu | 1999-10-19 |
| 5942841 | Row electrode anodization | — | 1999-08-24 |
| 5893724 | Method for forming a highly reliable and planar ball grid array package | Thiam B. Lim | 1999-04-13 |
| 5892290 | Highly reliable and planar ball grid array package | Thiam B. Lim | 1999-04-06 |
| 5836520 | Apparatus for dispensing fluid in an array pattern | Sarvotham Bhandarkar, Tai Chong Chai, Jian-Hua Wu | 1998-11-17 |
| 5609797 | Method for recording refractive index patterns in polyimide films | — | 1997-03-11 |
| 5436504 | Interconnect structures having tantalum/tantalum oxide layers | Minas H. Tanielian | 1995-07-25 |
| 5168542 | Low loss channel waveguide and method for making the same | Chung-Ping Chien | 1992-12-01 |
| 5149615 | Method for producing a planar surface on which a conductive layer can be applied | Minas H. Tanielian | 1992-09-22 |
| 5124238 | Fabrication of microelectronics using photosensitive polyimides | Chung-Ping Chien | 1992-06-23 |
| 5112448 | Self-aligned process for fabrication of interconnect structures in semiconductor applications | — | 1992-05-12 |
| 5098860 | Method of fabricating high-density interconnect structures having tantalum/tantalum oxide layers | Minas H. Tanielian | 1992-03-24 |
| 5081005 | Method for reducing chemical interaction between copper features and photosensitive dielectric compositions | Jay Cech | 1992-01-14 |
| 4988413 | Reducing plating anomalies in electroplated fine geometry conductive features | Lane S. Lathrop | 1991-01-29 |
| 4974048 | Integrated circuit having reroutable conductive paths | Peter L. Young | 1990-11-27 |