JM

J. Matayabas

IN Intel: 2 patents #13,213 of 30,777Top 45%
Overall (All Time): #2,143,414 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7332797 Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold Constance L. Gettinger 2008-02-19
7141454 Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold Constance L. Gettinger 2006-11-28