{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Intel", "item": "https://www.patentleaderboard.com/company/intel"}, {"@type": "ListItem", "position": 3, "name": "J. Matayabas", "item": "https://www.patentleaderboard.com/inventor/fl:j._ln:matayabas-1"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
JM

J. Matayabas — 2 Patents

Intel: 2 patents #13,316 of 30,777Top 45%
Chandler, AZ: #1,652 of 3,331 inventorsTop 50%
Arizona: #13,181 of 32,909 inventorsTop 45%
Overall (All Time): #1,709,992 of 4,157,543Top 45%
2 Patents All Time
J. Matayabas has been granted 2 US patents while listed as an inventor at Intel. The first was granted in 2006 and the most recent in February 2008. J. Matayabas ranks #1,709,992 of 4,157,543 US inventors in our database (top 41.1%). Patent records list J. Matayabas in Chandler, AZ, US.

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
7332797 Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold Constance L. Gettinger 2008-02-19 $15,849,000
7141454 Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold Constance L. Gettinger 2006-11-28 $16,743,000