Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7332797 | Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold | J. Matayabas | 2008-02-19 |
| 7141454 | Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold | J. Matayabas | 2006-11-28 |
| 6562448 | Low density dielectric having low microwave loss | Craig S. Chamberlain, Joan V. Brennan, Robert W. Wilson | 2003-05-13 |