Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7332797 | Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold | J. Matayabas | 2008-02-19 | $15,849,000 |
| 7141454 | Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold | J. Matayabas | 2006-11-28 | $16,743,000 |
| 6562448 | Low density dielectric having low microwave loss | Craig S. Chamberlain, Joan V. Brennan, Robert W. Wilson | 2003-05-13 | $22,888,000 |