Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6357330 | Method and apparatus for cutting a wafer | M. Lawrence A. Dass, Krishna Seshan | 2002-03-19 |
| 6046101 | Passivation technology combining improved adhesion in passivation and a scribe street without passivation | M. Lawrence A. Dass, Krishna Seshan | 2000-04-04 |