Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12113265 | Dual-stripline with crosstalk cancellation | Xiaoning Ye | 2024-10-08 | $19,971,000 |
| 11395402 | High-density dual-embedded microstrip interconnects | — | 2022-07-19 | $11,394,000 |
| 10925152 | Dielectric coating for crosstalk reduction | Xiaoning Ye, Jimmy Hsu, Daniel Hull | 2021-02-16 | $35,223,000 |
| 10607952 | High-density triple diamond stripline interconnects | — | 2020-03-31 | $34,068,000 |
| 9404940 | Compensating probing tip optimized adapters for use with specific electrical test probes | Julie A. Campbell, Lenny Rayzman | 2016-08-02 | |
| 7659790 | High speed signal transmission line having reduced thickness regions | Yigal Shaul | 2010-02-09 | $445,000 |
| 7378832 | Probing high-frequency signals | Julie A. Campbell, Lawrence Jacobs, Yigal Shaul | 2008-05-27 | $1,049,000 |