Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6468906 | Passivation of copper interconnect surfaces with a passivating metal layer | Lap Chan, Kuan Pei Yap, Kheng Chok Tee, Wye Boon Loh | 2002-10-22 |
| 6100195 | Passivation of copper interconnect surfaces with a passivating metal layer | Lap Chan, Kuan Pei Yap, Kheng Chok Tee, Wye Boon Loh | 2000-08-08 |