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Yeong-E Chen — 29 Patents

INInnolux: 25 patents #43 of 1,038Top 5%

ITITRI: 3 patents #2,499 of 9,619Top 30%

Jianmenkeng, TW: #33 of 244 inventorsTop 15%

Overall (All Time): #127,851 of 4,157,543Top 4%

29 Patents All Time

Yeong-E Chen has been granted 29 US patents while listed as an inventor at Innolux. The first was granted in 2000 and the most recent in October 2025. Yeong-E Chen ranks #127,851 of 4,157,543 US inventors in our database (top 3.1%). Patent records list Yeong-E Chen in Jianmenkeng, TW.

Patents per Year

Issued Patents All Time

Showing 1–25 of 29 patents

Patent #	Title	Co-Inventors	Date
D1097035	Climbing frame	—	2025-10-07
12376224	Package device	Yi-Hung Lin, Chun-Hung Lai, Chuan-Ming Yeh, Ching-Wei Chen	2025-07-29
12354919	Manufacturing method of package circuit	Bi-Ly LIN, Kuang-Chiang HUANG, Yu-Ting Liu	2025-07-08
12308289	Method for manufacturing an electronic device	Cheng-Chi Wang, Cheng-En Cheng	2025-05-20
12266646	Electronic device	—	2025-04-01
12224226	Electronic device	Chin-Lung Ting, Chung-Kuang Wei, Cheng-Chi Wang, Yi-Hung Lin	2025-02-11
12205854	Electronic device	Kuang-Chiang HUANG, Yu-Ting Liu, Yi-Hung Lin, Cheng-En Cheng	2025-01-21
12200857	Package device	Cheng-En Cheng, Yu-Ting Liu	2025-01-14
12148630	Method for manufacturing electronic device	Cheng-En Cheng, Yu-Ting Liu, Cheng-Chi Wang	2024-11-19
12148658	Method for manufacturing an electronic device	Cheng-Chi Wang, Cheng-En Cheng	2024-11-19
12148686	Package device and manufacturing method thereof	Cheng-En Cheng, Yu-Ting Liu	2024-11-19
12142554	Electronic component and manufacturing method thereof	Yi-Hung Lin, Cheng-En Cheng, Wen-Hsiang Liao, Cheng-Chi Wang	2024-11-12
12075566	Bonding pad structure	Yu-Ting Liu, Chean Kee	2024-08-27
12050374	Electronic device	Bi-Ly LIN	2024-07-30
11901315	Package device	Wei Chen, Chun-Yuan Huang	2024-02-13
11812549	Package device and manufacturing method thereof	Cheng-En Cheng, Yu-Ting Liu	2023-11-07
11798853	Manufacturing method of package device	Kuang-Chiang HUANG, Yu-Ting Liu, Yi-Hung Lin, Cheng-En Cheng	2023-10-24
11789066	Method for manufacturing electronic device having a seed layer on a substrate	—	2023-10-17
11776914	Package device	Cheng-En Cheng, Yu-Ting Liu	2023-10-03
11769685	Manufacturing method of semiconductor package	Cheng-Chi Wang, Wen-Hsiang Liao, Hung-Sheng Chou, Cheng-En Cheng	2023-09-26
11694999	Electronic device and fabrication method thereof	—	2023-07-04
11582865	Package device	Cheng-En Cheng, Yu-Ting Liu	2023-02-14
11551970	Method for manufacturing an electronic device	Cheng-Chi Wang, Cheng-En Cheng	2023-01-10
11406015	Bonding pad structure	Yu-Ting Liu, Chean Kee	2022-08-02
11398430	Package device and a manufacturing method thereof	Cheng-En Cheng, Yu-Ting Liu	2022-07-26