Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12376224 | Package device | Yi-Hung Lin, Chun-Hung Lai, Chuan-Ming Yeh, Ching-Wei Chen | 2025-07-29 |
| 12354919 | Manufacturing method of package circuit | Bi-Ly LIN, Kuang-Chiang HUANG, Yu-Ting Liu | 2025-07-08 |
| 12308289 | Method for manufacturing an electronic device | Cheng-Chi Wang, Cheng-En Cheng | 2025-05-20 |
| 12266646 | Electronic device | — | 2025-04-01 |
| 12224226 | Electronic device | Chin-Lung Ting, Chung-Kuang Wei, Cheng-Chi Wang, Yi-Hung Lin | 2025-02-11 |
| 12205854 | Electronic device | Kuang-Chiang HUANG, Yu-Ting Liu, Yi-Hung Lin, Cheng-En Cheng | 2025-01-21 |
| 12200857 | Package device | Cheng-En Cheng, Yu-Ting Liu | 2025-01-14 |
| 12148630 | Method for manufacturing electronic device | Cheng-En Cheng, Yu-Ting Liu, Cheng-Chi Wang | 2024-11-19 |
| 12148658 | Method for manufacturing an electronic device | Cheng-Chi Wang, Cheng-En Cheng | 2024-11-19 |
| 12148686 | Package device and manufacturing method thereof | Cheng-En Cheng, Yu-Ting Liu | 2024-11-19 |
| 12142554 | Electronic component and manufacturing method thereof | Yi-Hung Lin, Cheng-En Cheng, Wen-Hsiang Liao, Cheng-Chi Wang | 2024-11-12 |
| 12075566 | Bonding pad structure | Yu-Ting Liu, Chean Kee | 2024-08-27 |
| 12050374 | Electronic device | Bi-Ly LIN | 2024-07-30 |
| 11901315 | Package device | Wei Chen, Chun-Yuan Huang | 2024-02-13 |
| 11812549 | Package device and manufacturing method thereof | Cheng-En Cheng, Yu-Ting Liu | 2023-11-07 |
| 11798853 | Manufacturing method of package device | Kuang-Chiang HUANG, Yu-Ting Liu, Yi-Hung Lin, Cheng-En Cheng | 2023-10-24 |
| 11789066 | Method for manufacturing electronic device having a seed layer on a substrate | — | 2023-10-17 |
| 11776914 | Package device | Cheng-En Cheng, Yu-Ting Liu | 2023-10-03 |
| 11769685 | Manufacturing method of semiconductor package | Cheng-Chi Wang, Wen-Hsiang Liao, Hung-Sheng Chou, Cheng-En Cheng | 2023-09-26 |
| 11694999 | Electronic device and fabrication method thereof | — | 2023-07-04 |
| 11582865 | Package device | Cheng-En Cheng, Yu-Ting Liu | 2023-02-14 |
| 11551970 | Method for manufacturing an electronic device | Cheng-Chi Wang, Cheng-En Cheng | 2023-01-10 |
| 11406015 | Bonding pad structure | Yu-Ting Liu, Chean Kee | 2022-08-02 |
| 11398430 | Package device and a manufacturing method thereof | Cheng-En Cheng, Yu-Ting Liu | 2022-07-26 |
| 11378618 | Method for manufacturing electronic device having a seed layer on a substrate | — | 2022-07-05 |