Issued Patents All Time
Showing 126–144 of 144 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5965635 | Alkylacrylate ester composition for anchoring materials in or to concrete or masonry | Michael J. Rancich, Cyndie S. Hackl | 1999-10-12 |
| 5917202 | Highly reflective contacts for light emitting semiconductor devices | Roland H. Haitz | 1999-06-29 |
| 5837561 | Fabrication of transparent substrate vertical cavity surface emitting lasers by semiconductor wafer bonding | Richard P. Schneider | 1998-11-17 |
| 5793062 | Transparent substrate light emitting diodes with directed light output | Stephen A. Stockman | 1998-08-11 |
| 5783477 | Method for bonding compounds semiconductor wafers to create an ohmic interface | David A. Vanderwater | 1998-07-21 |
| 5779924 | Ordered interface texturing for a light emitting device | Michael R. Krames | 1998-07-14 |
| 5724376 | Transparent substrate vertical cavity surface emitting lasers fabricated by semiconductor wafer bonding | Richard P. Schneider | 1998-03-03 |
| 5661316 | Method for bonding compound semiconductor wafers to create an ohmic interface | David A. Vanderwater | 1997-08-26 |
| 5643994 | Anchoring systems and methods utilizing acrylate compositions | Michael J. Rancich, Cyndie S. Hackl | 1997-07-01 |
| 5581571 | Semiconductor devices and methods | Nick Holonyak, Jr., Steven A. Maranowski | 1996-12-03 |
| 5550081 | Method of fabricating a semiconductor device by oxidizing aluminum-bearing 1H-V semiconductor in water vapor environment | Nick Holonyak, Jr., Steven A. Maranowski | 1996-08-27 |
| 5517039 | Semiconductor devices fabricated with passivated high aluminum-content III-V material | Nick Holonyak, Jr., Tim A. Richard, Mark R. Keever, Chun Lei, Serge L. Rudaz | 1996-05-14 |
| 5502316 | Wafer bonding of light emitting diode layers | Frank M. Steranka, Dennis C. DeFevere, Virginia Robbins, John Uebbing | 1996-03-26 |
| 5425043 | Semiconductor laser | Nick Holonyak, Jr., Nada El-Zein | 1995-06-13 |
| 5403775 | Method of making semiconductor devices and techniques for controlled optical confinement | Nick Holonyak, Jr., Stephen J. Caracci | 1995-04-04 |
| 5400354 | Laminated upper cladding structure for a light-emitting device | Michael J. Ludowise, Nick Holonyak, Jr., Stephen J. Caracci, Michael R. Krames | 1995-03-21 |
| 5376580 | Wafer bonding of light emitting diode layers | Frank M. Steranka, Dennis C. DeFevere, Virginia Robbins, John Uebbing | 1994-12-27 |
| 5353295 | Semiconductor laser device with coupled cavities | Nick Holonyak, Jr., Nada El-Zein | 1994-10-04 |
| 5327448 | Semiconductor devices and techniques for controlled optical confinement | Nick Holonyak, Jr., Stephen J. Caracci | 1994-07-05 |