Issued Patents All Time
Showing 26–50 of 86 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9041196 | Semiconductor module arrangement and method for producing and operating a semiconductor module arrangement | — | 2015-05-26 |
| 8999758 | Fixing semiconductor die in dry and pressure supported assembly processes | — | 2015-04-07 |
| 8992267 | Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and an electrically conductive second connector | — | 2015-03-31 |
| 8922030 | Moisture-tight semiconductor module and method for producing a moisture-tight semiconductor module | — | 2014-12-30 |
| 8866298 | Bonded system with coated copper conductor | — | 2014-10-21 |
| 8823175 | Reliable area joints for power semiconductors | — | 2014-09-02 |
| 8787003 | Low inductance capacitor module and power system with low inductance capacitor module | Daniel Domes | 2014-07-22 |
| 8773172 | Driver circuit with tight control of gate voltage | — | 2014-07-08 |
| 8593817 | Power semiconductor module and method for operating a power semiconductor module | Thilo Stolze | 2013-11-26 |
| 8587116 | Semiconductor module comprising an insert | Olaf Hohlfeld | 2013-11-19 |
| 8487407 | Low impedance gate control method and apparatus | Daniel Domes | 2013-07-16 |
| 8478559 | Semiconductor component and method of making the same | Patrick Baginski, Holger Ruething, Daniel Domes | 2013-07-02 |
| 8472949 | Semiconductor assembly | Markus Thoben | 2013-06-25 |
| 8466548 | Semiconductor device including excess solder | Niels Oeschler, Alexander Ciliox | 2013-06-18 |
| 8344764 | Circuit arrangement including voltage supply circuit | Peter Kanschat, Uwe Jansen | 2013-01-01 |
| 8319335 | Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly | Olaf Hohlfeld, Thilo Stolze | 2012-11-27 |
| 8317525 | Press-fit connections for electronic modules | — | 2012-11-27 |
| 8309395 | Method of fabricating a high-temperature compatible power semiconductor module | — | 2012-11-13 |
| 8298867 | Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bond | Olaf Hohlfeld, Jens Goerlich | 2012-10-30 |
| 8222741 | Semiconductor module with current connection element | Guido Strotmann, Dirk Froebus, Reinhold Spanke | 2012-07-17 |
| 8222928 | Circuit arrangement including voltage supply circuit | — | 2012-07-17 |
| 8212413 | Circuit assembly for gating a power semiconductor switch | Uwe Jansen, Ulrich Michael Georg Schwarzer | 2012-07-03 |
| 8198721 | Semiconductor module | Thomas Licht, Dirk Siepe | 2012-06-12 |
| 8167187 | Method and device for producing a bondable area region on a carrier | Thomas Licht, Alfred Kemper | 2012-05-01 |
| 8164176 | Semiconductor module arrangement | Dirk Siepe | 2012-04-24 |