Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049311 | Electronic component and method for its production | Chee Chian Lim, Yoke Chin Goh, May Ting Hng | 2011-11-01 |
| 7615410 | Chip-sized flip-chip semiconductor package and method for making the same | Bun-Hin Keong, Abdul Rahman Mohamed | 2009-11-10 |
| 7432584 | Leadframe for use in a semiconductor package | Bun-Hin Keong | 2008-10-07 |