Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7615410 | Chip-sized flip-chip semiconductor package and method for making the same | Koh Hoo Goh, Abdul Rahman Mohamed | 2009-11-10 |
| 7432584 | Leadframe for use in a semiconductor package | Koh Hoo Goh | 2008-10-07 |