Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8907501 | Method of packaging a die | — | 2014-12-09 |
| 8637977 | Semiconductor device and method of packaging a semiconductor device with a clip | Boon Huat Lim, Yoke Chin Goh | 2014-01-28 |
| 8604595 | Multi-chip electronic package with reduced stress | May Ting Hng | 2013-12-10 |
| 8563357 | Method of packaging a die | — | 2013-10-22 |
| 8486757 | Semiconductor device and method of packaging a semiconductor device with a clip | Boon Huat Lim, Yoke Chin Goh | 2013-07-16 |
| 8373279 | Die package | — | 2013-02-12 |
| RE43818 | Fabrication of an integrated circuit package | — | 2012-11-20 |
| 8049311 | Electronic component and method for its production | Yoke Chin Goh, Koh Hoo Goh, May Ting Hng | 2011-11-01 |
| 7956459 | Semiconductor device and method of assembly | — | 2011-06-07 |
| 7944050 | Integrated circuit device and a method of making the integrated circuit device | — | 2011-05-17 |
| 7618845 | Fabrication of an integrated circuit package | — | 2009-11-17 |
| 7553745 | Integrated circuit package, panel and methods of manufacturing the same | — | 2009-06-30 |