Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362023 | Package lead design with grooves for improved dambar separation | Jayaganasan Narayanasamy, Meng How Chong, Elmer Senorin Holgado, Chee Ming Lam, Sanjay Kumar Murugan +2 more | 2022-06-14 |