Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5903052 | Structure for semiconductor package for improving the efficiency of spreading heat | Lung-Tai Chen, Yu-Kon Chou, Chien-Chi Chao | 1999-05-11 |
| 5695109 | Solder paste inter-layer alignment apparatus for area-array on-board rework | Lung-Tai Chen, Yu-Kon Chou | 1997-12-09 |