Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5903052 | Structure for semiconductor package for improving the efficiency of spreading heat | Lung-Tai Chen, Ping-Huang Chiang, Yu-Kon Chou | 1999-05-11 |
| 5581122 | Packaging assembly with consolidated common voltage connections for integrated circuits | Ming-Hane Lin, Ted Ho | 1996-12-03 |