Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191219 | Gas-permeable package lid of chip package structure and manufacturing method thereof | Chin-Sheng Chang, Bor-Shiun Lee, Chih-Hsiang Ko | 2025-01-07 |
| 9445212 | MEMS microphone module and manufacturing process thereof | Chun-Hsun Chu, Wood-Hi Cheng | 2016-09-13 |
| 9343651 | Organic packaging carrier | Tzong-Che Ho, Li-Chi Pan, Yu-Wen Fan | 2016-05-17 |
| 9133018 | Structure and fabrication method of a sensing device | Yu-Wen Hsu, Sheah Chen, Jing-Yuan Lin, Li-Chi Pan, Tzong-Che Ho | 2015-09-15 |
| 8763457 | Sensing device and manufacturing method thereof | Yu-Wen Hsu, Tzong-Che Ho, Li-Chi Pan | 2014-07-01 |
| 8693711 | Capacitive transducer and fabrication method | Tzong-Che Ho, Yao-Jung Lee, Chao-Ta Huang, Li-Chi Pan, Yu-Sheng Hsieh | 2014-04-08 |
| 8643125 | Structure and process for microelectromechanical system-based sensor | Shih-Chieh Lin, Yu-Wen Hsu | 2014-02-04 |
| 8421216 | Vacuum hermetic organic packaging carrier | Tzong-Che Ho, Li-Chi Pan, Yu-Wen Fan | 2013-04-16 |
| 8421543 | Crystal oscillator and method for manufacturing the same | Yu-Wen Hsu, Tzung-Ching Lee, Chao-Ta Huang | 2013-04-16 |
| 7973454 | Vacuum hermetic organic packaging carrier and sensor device package | Tzong-Che Ho, Li-Chi Pan, Yu-Wen Fan | 2011-07-05 |
| 7915065 | Wafer level sensing package and manufacturing process thereof | Chun-Hsun Chu, Tzong-Che Ho, Bor-Chen Tsai | 2011-03-29 |
| 7791181 | Device structure with preformed ring and method therefor | Chun-Hsun Chu | 2010-09-07 |
| 5903052 | Structure for semiconductor package for improving the efficiency of spreading heat | Ping-Huang Chiang, Yu-Kon Chou, Chien-Chi Chao | 1999-05-11 |
| 5695109 | Solder paste inter-layer alignment apparatus for area-array on-board rework | Ping-Huang Chiang, Yu-Kon Chou | 1997-12-09 |