Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12232256 | Flexible hybrid electronic substrate and electronic textile including the same | I-Hung Chiang, Hung-Hsien Ko, Min-Hsiung Liang, Te-Hsun Lin, Hao Yu | 2025-02-18 |
| 11646259 | Redistribution structure and forming method thereof | Shu-Wei Kuo, Wei-Yuan Cheng, Chien-Hsun Chu, Shau-Fei Cheng | 2023-05-09 |
| 11362045 | Chip package structure | Te-Hsun Lin, Kuan-Chu Wu, Shao-An Yan | 2022-06-14 |
| 10757804 | Flexible hybrid electronic system and method of reducing the impact thereof | Yu-Ming Peng, Kuan-Chu Wu, Kai-Ming Chang | 2020-08-25 |
| 10622326 | Chip package structure | Ko-Chin Yang, Jui-Chang Chuang, Yen-Ting Wu, Chia-Hua Lu | 2020-04-14 |
| 10461035 | Semiconductor package structure | Shu-Wei Kuo, Wei-Yuan Cheng, Jie-Mo Lin | 2019-10-29 |
| 10384434 | Separating device and separating method | Ko-Chin Yang, Shi-Chang Chen, Cheng-Yi Wang, Yen-Ting Wu | 2019-08-20 |
| 10249567 | Redistribution layer structure of semiconductor package | Jie-Mo Lin, Shu-Wei Kuo, Wei-Yuan Cheng | 2019-04-02 |