Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10622326 | Chip package structure | Chen-Tsai Yang, Jui-Chang Chuang, Yen-Ting Wu, Chia-Hua Lu | 2020-04-14 |
| 10384434 | Separating device and separating method | Chen-Tsai Yang, Shi-Chang Chen, Cheng-Yi Wang, Yen-Ting Wu | 2019-08-20 |
| 9655244 | Flexible electronic device and method for manufacturing the same | Chen-Chu Tsai, Cheng-Yi Wang, Yuh-Zheng Lee, Shi-Chang Chen | 2017-05-16 |
| 7626651 | Method for manufacturing an LCD device defining a TFD structure using a second mask removing a first metal layer, an insulating layer and a second metal layer to expose a transparent electrode layer | Wei-Hung Kuo, Weng-Bing Chou | 2009-12-01 |
| 6913957 | Method of fabricating a thin film transistor array panelsubstrate | — | 2005-07-05 |