Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021018 | Conductive circuit carrier module | Yu-Wei Huang | 2024-06-25 |
| 11646259 | Redistribution structure and forming method thereof | Shu-Wei Kuo, Chen-Tsai Yang, Wei-Yuan Cheng, Chien-Hsun Chu | 2023-05-09 |
| 10366965 | Chip bonding apparatus, chip bonding method and a chip package structure | Shu-Wei Kuo, Wei-Yuan Cheng | 2019-07-30 |