Issued Patents All Time
Showing 76–100 of 101 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8345431 | Thin multi-chip flex module | James E. Clayton | 2013-01-01 |
| RE42252 | Thin multi-chip flex module | James E. Clayton | 2011-03-29 |
| 7901536 | Resonating conductive traces and methods of using same for bonding components | Steve Greathouse, Robert L. Hubbard, Iftikhar Ahmad | 2011-03-08 |
| 7796399 | Thin multi-chip flex module | James E. Clayton | 2010-09-14 |
| 7787254 | Thin multichip flex-module | James E. Clayton | 2010-08-31 |
| 7724530 | Thin multi-chip flex module | James E. Clayton | 2010-05-25 |
| 7520781 | Thin multichip flex-module | James E. Clayton | 2009-04-21 |
| 7429788 | Thin multichip flex-module | James E. Clayton | 2008-09-30 |
| 7393226 | Thin multichip flex-module | James E. Clayton | 2008-07-01 |
| 7394149 | Thin multichip flex-module | James E. Clayton | 2008-07-01 |
| 6758609 | Methods and apparatus of joining optically coupled optoelectronic and fiber optic components using electromagnetic radiation | William L. Geisler, Joseph M. Wander, Iftikhar Ahmad, Richard S. Garard | 2004-07-06 |
| 6744027 | Microwave thawing apparatus and method | Robert J. Lauf, April D. McMillan | 2004-06-01 |
| 6707018 | Microwave thawing package and method | Robert J. Lauf | 2004-03-16 |
| 6497786 | Methods and apparatus for bonding deformable materials having low deformation temperatures | Bruce J. Kilgore, Thomas J. McKnight, Roy Lynn O'Mohunddro, John Battista, Richard J. Petrucci +1 more | 2002-12-24 |
| 6312548 | Conductive insert for bonding components with microwave energy | Richard S. Garard, Jianghua Wei | 2001-11-06 |
| 6268596 | Apparatus and method for microwave processing of liquids | Robert J. Lauf, Denise A. Tucker | 2001-07-31 |
| 6222170 | Apparatus and method for microwave processing of materials using field-perturbing tool | Denise A. Tucker, Robert J. Lauf | 2001-04-24 |
| 6103812 | Microwave curable adhesive | Jianghua Wei | 2000-08-15 |
| 5879756 | Curing polymer layers on semiconductor substrates using variable frequency microwave energy | Denise A. Tucker, Richard S. Garard, Jianghua Wei | 1999-03-09 |
| 5844216 | System and apparatus for reducing arcing and localized heating during microwave processing | Richard S. Garard, Jianghua Wei | 1998-12-01 |
| 5804801 | Adhesive bonding using variable frequency microwave energy | Robert J. Lauf, April D. McMillan, Felix L. Paulauskas, Jianghua Wei | 1998-09-08 |
| 5798395 | Adhesive bonding using variable frequency microwave energy | Robert J. Lauf, April D. McMillan, Felix L. Paulauskas, Jianghua Wei | 1998-08-25 |
| 5750968 | System and apparatus for reducing arcing and localized heating during microwave processing | Richard S. Gerard, Jianghua Wei | 1998-05-12 |
| 5738915 | Curing polymer layers on semiconductor substrates using variable frequency microwave energy | Denise A. Tucker, Richard S. Garard, Jianghua Wei | 1998-04-14 |
| 5648038 | Systems and methods for monitoring material properties using microwave energy | Richard S. Garard, Jianghua Wei, Michael L. Hampton | 1997-07-15 |