| 8964390 |
Sectioned manifolds facilitating pumped immersion-cooling of electronic components |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more |
2015-02-24 |
| 8959941 |
Data center cooling with an air-side economizer and liquid-cooled electronics rack(s) |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madusudan K. Iyengar, Roger R. Schmidt +1 more |
2015-02-24 |
| 8955347 |
Air-side economizer facilitating liquid-based cooling of an electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madusudan K. Iyengar, Roger R. Schmidt +1 more |
2015-02-17 |
| 8953320 |
Coolant drip facilitating partial immersion-cooling of electronic components |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more |
2015-02-10 |
| 8953317 |
Wicking vapor-condenser facilitating immersion-cooling of electronic component(s) |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons |
2015-02-10 |
| 8947873 |
Immersion-cooled and conduction-cooled electronic system |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more |
2015-02-03 |
| 8941994 |
Vapor condenser with three-dimensional folded structure |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more |
2015-01-27 |
| 8934250 |
Immersion-cooling of selected electronic component(s) mounted to printed circuit board |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more |
2015-01-13 |
| 8929080 |
Immersion-cooling of selected electronic component(s) mounted to printed circuit board |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more |
2015-01-06 |
| 8925333 |
Thermoelectric-enhanced air and liquid cooling of an electronic system |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more |
2015-01-06 |
| 8922998 |
Coolant manifold with separately rotatable manifold section(s) |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Eric J. McKeever +1 more |
2014-12-30 |
| 8913384 |
Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) |
David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil, Pritish R. Parida +2 more |
2014-12-16 |
| 8879257 |
Combined power and cooling rack supporting an electronics rack(s) |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons |
2014-11-04 |
| 8867209 |
Two-phase, water-based immersion-cooling apparatus with passive deionization |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madusudan K. Iyengar, Robert E. Simons +1 more |
2014-10-21 |
| 8824143 |
Combined power and cooling rack supporting an electronics rack(S) |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons |
2014-09-02 |
| 8817465 |
Multi-rack assembly with shared cooling apparatus |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons |
2014-08-26 |
| 8817474 |
Multi-rack assembly with shared cooling unit |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons |
2014-08-26 |
| 8806749 |
Two-phase, water-based immersion-cooling apparatus with passive deionization |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons +1 more |
2014-08-19 |
| 8797740 |
Multi-rack assembly method with shared cooling unit |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons |
2014-08-05 |
| 8760863 |
Multi-rack assembly with shared cooling apparatus |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons |
2014-06-24 |
| 8743545 |
Thermal expansion-enhanced heat sink for an electronic assembly |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons +1 more |
2014-06-03 |
| 8739406 |
Vapor condenser with three-dimensional folded structure |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more |
2014-06-03 |
| 8720063 |
Thermal expansion-enhanced heat sink for an electronic assembly |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madnusudan K. Iyengar, Robert E. Simons +1 more |
2014-05-13 |
| 8713957 |
Thermoelectric-enhanced, vapor-condenser facilitating immersion-cooling of electronic component(s) |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons |
2014-05-06 |
| 8713955 |
Intra-condenser contaminant extractor for a vapor-compression refrigeration apparatus |
Levi A. Campbell, Richard C. Chu, Evan G. Colgan, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2014-05-06 |
