| 10169624 |
Tamper-proof electronic packages with two-phase dielectric fluid |
Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr. |
2019-01-01 |
| 10160072 |
Liquid-cooled, composite heat sink assemblies |
Dylan J. Boday, Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt +3 more |
2018-12-25 |
| 10082048 |
Fuel vaporization using data center waste heat |
Milnes P. David, Dustin W. Demetriou, Roger R. Schmidt, Robert E. Simons |
2018-09-25 |
| 10070560 |
Drawer-level immersion-cooling with hinged, liquid-cooled heat sink |
Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons |
2018-09-04 |
| 10024606 |
Fabricating thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s) |
Amilcar R. Arvelo, Mark A. Brandon, Michael J. Ellsworth, Jr., Randall G. Kemink, Eric J. McKeever |
2018-07-17 |
| 9968006 |
Locking louver assembly for air-moving assembly |
Christopher R. Ciraulo, Milnes P. David, Dustin W. Demetriou, Robert K. Mullady, Roger R. Schmidt |
2018-05-08 |
| 9949412 |
Thermoelectric-enhanced, inlet air-cooled thermal conductors |
Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons |
2018-04-17 |
| 9907211 |
Locking louver assembly for air-moving assembly |
Christopher R. Ciraulo, Milnes P. David, Dustin W. Demetriou, Robert K. Mullady, Roger R. Schmidt |
2018-02-27 |
| 9904811 |
Tamper-proof electronic packages with two-phase dielectric fluid |
Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr. |
2018-02-27 |
| 9865522 |
Composite heat sink structures |
Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons |
2018-01-09 |
| 9861010 |
Protective louver assembly for air-moving assembly |
Christopher R. Ciraulo, Milnes P. David, Dustin W. Demetriou, Robert K. Mullady, Roger R. Schmidt |
2018-01-02 |
| 9795055 |
Electronics cooling assembly with multi-position, airflow-blocking mechanism |
Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr. |
2017-10-17 |
| 9761508 |
Composite heat sink structures |
Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons |
2017-09-12 |
| 9763357 |
Fabricating a liquid-cooling apparatus with coolant filter |
Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more |
2017-09-12 |
| 9750159 |
Pump-enhanced, immersion-cooling of electronic compnent(s) |
Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more |
2017-08-29 |
| 9687943 |
Heat sink structure with a vapor-permeable membrane for two-phase cooling |
Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons |
2017-06-27 |
| 9686889 |
Field-replaceable bank of immersion-cooled electronic components |
Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more |
2017-06-20 |
| 9686891 |
Thermoelectric-enhanced, inlet air cooling for an electronics rack |
Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons |
2017-06-20 |
| 9677987 |
Measurement of particulate matter deliquescence relative humidity |
Prabjit Singh, Jing Zhang |
2017-06-13 |
| 9661784 |
Multi-component electronic module with integral coolant-cooling |
Amilcar R. Arvelo, Michael J. Ellsworth, Jr., Eric J. McKeever |
2017-05-23 |
| 9648786 |
Interlock assembly for air-moving assembly |
Christopher R. Ciraulo, Milnes P. David, Dustin W. Demetriou, John J. Loparco, Robert K. Mullady +4 more |
2017-05-09 |
| 9629286 |
Thermoelectric-enhanced, inlet air cooling for an electronics rack |
Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons |
2017-04-18 |
| 9629284 |
Interlock assembly for air-moving assembly |
Christopher R. Ciraulo, Milnes P. David, Dustin W. Demetriou, John J. Loparco, Robert K. Mullady +4 more |
2017-04-18 |
| 9623520 |
Heat sink structure with a vapor-permeable membrane for two-phase cooling |
Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons |
2017-04-18 |
| 9622379 |
Drawer-level immersion-cooling with hinged, liquid-cooled heat sink |
Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons |
2017-04-11 |
