EC

Eric J. Campbell

IBM: 156 patents #268 of 70,183Top 1%
DP Dell Products: 1 patents #3,684 of 6,820Top 55%
📍 Rochester, MN: #9 of 3,042 inventorsTop 1%
🗺 Minnesota: #60 of 52,454 inventorsTop 1%
Overall (All Time): #5,585 of 4,157,543Top 1%
157
Patents All Time

Issued Patents All Time

Showing 76–100 of 157 patents

Patent #TitleCo-InventorsDate
10696899 Light emitting shell in multi-compartment microcapsules Sarah K. Czaplewski, Joseph Kuczynski, Timothy J. Tofil 2020-06-30
10684220 In-situ detection of glass fiber defects Bruce J. Chamberlin, Sarah K. Czaplewski, Scott B. King, Joseph Kuczynski 2020-06-16
10678316 Reducing thermal cycling fatigue Sarah K. Czaplewski-Campbell, Jennifer I. Bennett 2020-06-09
10662299 Heat generating microcapsules for self-healing polymer applications Sarah K. Czaplewski, Joseph Kuczynski, Timothy J. Tofil 2020-05-26
10667433 Implementing contained thermal interface material for pluggable applications Jennifer I. Bennett, Sarah K. Czaplewski-Campbell, Elin F. LaBreck 2020-05-26
10665909 Battery thermal run-away and combustion prevention system Sarah K. Czaplewski, Jennifer I. Porto, Elin F. LaBreck 2020-05-26
10640608 Phosphorus-containing caprolactone monomers for synthesis of flame retardant polycaprolactones Sarah K. Czaplewski, Brandon M. Kobilka, Jason T. Wertz 2020-05-05
10618023 Formation of a janus microcapsule Jason T. Wertz, Brandon M. Kobilka, Sarah K. Czaplewski 2020-04-14
10613283 Coaxial wire and optical fiber trace via hybrid structures and methods to manufacture Daniel J. Buvid, Sarah K. Czaplewski, Christopher W. Steffen 2020-04-07
10610980 Self-heating solder flux material Sarah K. Czaplewski-Campbell, Joseph Kuczynski, Timothy J. Tofil 2020-04-07
10615095 Implementing strain sensing thermal interface materials Sarah K. Czaplewski-Campbell, Timothy J. Tofil, Joseph Kuczynski 2020-04-07
10595422 Tamper resistant electronic devices Sarah K. Czaplewski, Patrick K. Egan, Joseph Kuczynski, Timothy J. Tofil 2020-03-17
10578551 In-situ detection of hollow glass fiber formation Bruce J. Chamberlin, Sarah K. Czaplewski, Scott B. King, Joseph Kuczynski 2020-03-03
10570336 Impact-modified hydroxyapatite as flame retardant polymer fillers Sarah K. Czaplewski, Brandon M. Kobilka, Jason T. Wertz 2020-02-25
10575393 Heat-shielding microcapsules for protecting temperature sensitive components Jennifer I. Bennett, Sarah K. Czaplewski-Campbell, Elin F. LaBreck 2020-02-25
10554347 Low latency corrupt data tagging on a cross-chip link Chad Albertson, Nicholas Ollerich, Christopher W. Steffen, Curtis C. Wollbrink 2020-02-04
10535617 Implementing transient electronic circuits for security applications Sarah K. Czaplewski-Campbell, Timothy J. Tofil, Joseph Kuczynski 2020-01-14
10426030 Trace/via hybrid structure multichip carrier Chad Albertson, Nicholas Ollerich, Christopher W. Steffen 2019-09-24
10396050 Chip alignment utilizing superomniphobic surface treatment of silicon die Sarah K. Czaplewski, Joseph Kuczynski, Timothy J. Tofil 2019-08-27
10396944 Low latency corrupt data tagging on a cross-chip link Chad Albertson, Nicholas Ollerich, Christopher W. Steffen, Curtis C. Wollbrink 2019-08-27
10392452 Light generating microcapsules for self-healing polymer applications Sarah K. Czaplewski, Joseph Kuczynski, Timothy J. Tofil 2019-08-27
10381324 Selectively cross-linked thermal interface materials Sarah K. Czaplewski, Elin F. LaBreck, Jennifer I. Porto 2019-08-13
10377020 Fastener head adapter Sarah K. Czaplewski, Elin F. LaBreck, Jennifer I. Porto 2019-08-13
10372182 Reducing thermal cycling fatigue Sarah K. Czaplewski-Campbell, Jennifer I. Bennett 2019-08-06
10357921 Light generating microcapsules for photo-curing Sarah K. Czaplewski, Joseph Kuczynski, Timothy J. Tofil 2019-07-23