Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9040843 | Multilayer printed wiring board | Yoichiro Kawamura, Tomoyuki Ikeda | 2015-05-26 |
| 8533943 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai +3 more | 2013-09-17 |
| 8324512 | Multilayer printed wiring board | Yoichiro Kawamura, Tomoyuki Ikeda | 2012-12-04 |
| 8093507 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai +3 more | 2012-01-10 |
| 8030579 | Multilayer printed wiring board | Yoichiro Kawamura, Tomoyuki Ikeda | 2011-10-04 |
| 8030577 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai +3 more | 2011-10-04 |
| 8020291 | Method of manufacturing a printed wiring board | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai +3 more | 2011-09-20 |
| 8018045 | Printed circuit board | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai +3 more | 2011-09-13 |
| 8006377 | Method for producing a printed wiring board | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai +3 more | 2011-08-30 |
| 7994433 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai +3 more | 2011-08-09 |
| 7916492 | Multilayered printed circuit board | Hui Zhong, Kenichi Shimada, Motoo Asai, Dongdong Wang, Koji Sekine +1 more | 2011-03-29 |
| 7910836 | Multilayered printed circuit board, solder resist composition, and semiconductor device | Hui Zhong, Kenichi Shimada, Motoo Asai, Dongdong Wang, Koji Sekine +1 more | 2011-03-22 |
| 7535095 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai +3 more | 2009-05-19 |
| 7504719 | Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai +3 more | 2009-03-17 |
| 7371974 | Multilayer printed wiring board | Yoichiro Kawamura, Tomoyuki Ikeda | 2008-05-13 |