YH

Yasuji Hiramatsu

IC Ibiden Co.: 54 patents #8 of 730Top 2%
IC Ishikawa Gasket Co.: 1 patents #27 of 48Top 60%
Overall (All Time): #46,298 of 4,157,543Top 2%
55
Patents All Time

Issued Patents All Time

Showing 51–55 of 55 patents

Patent #TitleCo-InventorsDate
6242079 Printed wiring board and method for manufacturing the same Yukinobu Mikado, Honchin En 2001-06-05
6217988 Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler Toshihiko Yasue, Hideki Yano, Yoshifumi Ishitani, Yoichiro Kawamura, Hideki Murase +3 more 2001-04-17
6010768 Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler Toshihiko Yasue, Hideki Yano, Yoshifumi Ishitani, Yoichiro Kawamura, Hideki Murase +3 more 2000-01-04
5192719 Method of producing high-strength .beta.-type silicon carbide sintered bodies Hidetoshi Yamauchi, Haruhisa Hasegawa 1993-03-09
4869516 Steel laminate gaskets Tsunekazu Udagawa, Hidetaka Nakasone, Yoshio Yamada 1989-09-26