Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6251502 | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler | Toshihiko Yasue, Yasuji Hiramatsu, Hideki Yano, Yoshifumi Ishitani, Yoichiro Kawamura +3 more | 2001-06-26 |
| 6217988 | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler | Toshihiko Yasue, Yasuji Hiramatsu, Hideki Yano, Yoshifumi Ishitani, Yoichiro Kawamura +3 more | 2001-04-17 |
| 6010768 | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler | Toshihiko Yasue, Yasuji Hiramatsu, Hideki Yano, Yoshifumi Ishitani, Yoichiro Kawamura +3 more | 2000-01-04 |