Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6379490 | System for improving the total thickness variation of a wafer | James F. Nester, Charles B. Zarowin | 2002-04-30 |
| 5336355 | Methods and apparatus for confinement of a plasma etch region for precision shaping of surfaces of substances and films | Charles B. Zarowin | 1994-08-09 |
| 5290382 | "Methods and apparatus for generating a plasma for ""downstream"" rapid shaping of surfaces of substrates and films" | Charles B. Zarowin | 1994-03-01 |
| 5291415 | Method to determine tool paths for thinning and correcting errors in thickness profiles of films | Charles B. Zarowin | 1994-03-01 |
| 5254830 | System for removing material from semiconductor wafers using a contained plasma | Charles B. Zarowin | 1993-10-19 |
| 5238532 | Method and apparatus for removal of subsurface damage in semiconductor materials by plasma etching | Charles B. Zarowin | 1993-08-24 |