Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748757 | Thermally removable fill materials for anti-stiction applications | Desaraju V. Varaprasad | 2020-08-18 |
| 10727044 | Fill material to mitigate pattern collapse | Desaraju V. Varaprasad, Joseph Kennedy | 2020-07-28 |
| 10544329 | Polysiloxane formulations and coatings for optoelectronic applications | Desaraju V. Varaprasad, Sudip Mukhopadhyay, Amanuel H. Gebrehrhan, Hai Bien | 2020-01-28 |
| 10329452 | Materials and spin coating methods suitable for advanced planarization applications | Desaraju V. Varaprasad, Ronald R. Katsanes | 2019-06-25 |
| 8642246 | Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof | Joseph Kennedy, Kim Do, Sudip Mukhopadhyay | 2014-02-04 |
| 7381442 | Porogens for porous silica dielectric for integral circuit applications | Victor Lu, Roger Leung, Eric Deng | 2008-06-03 |
| 7381441 | Low metal porous silica dielectric for integral circuit applications | Roger Leung, Eric Deng, Victor Lu | 2008-06-03 |
| 7011889 | Organosiloxanes | William B. Bedwell, Nigel Hacker, Roger Leung, Nancy Iwamoto, Jan Nedbal +2 more | 2006-03-14 |
| 6967172 | Colloidal silica composite films for premetal dielectric applications | Roger Leung, Denis Endisch, Nigel Hacker, Yanpei Deng | 2005-11-22 |
| 6962727 | Organosiloxanes | William B. Bedwell, Nigel Hacker, Roger Leung, Nancy Iwamoto, Jan Nedbal +2 more | 2005-11-08 |
| 6653718 | Dielectric films for narrow gap-fill applications | Roger Leung, Denis Endisch, Nigel Hacker, Yanpei Deng | 2003-11-25 |
| 6444495 | Dielectric films for narrow gap-fill applications | Roger Leung, Denis Endisch, Nigel Hacker, Yanpei Deng | 2002-09-03 |