Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4853343 | Method for fabricating a semiconductor integrated circuit device having thick oxide films and groove etch and refill | Akihisa Uchida, Daisuke Okada, Toshihiko Takakura, Katsumi Ogiue, Masao Kawamura | 1989-08-01 |
| 4819054 | Semiconductor IC with dual groove isolation | Mikinori Kawaji, Toshihiko Takakura, Akihisa Uchida, Shigeo Kuroda, Takeo Shiba +2 more | 1989-04-04 |
| 4746963 | Isolation regions formed by locos followed with groove etch and refill | Akihisa Uchida, Daisuke Okada, Toshihiko Takakura, Katsumi Ogiue, Masao Kawamura | 1988-05-24 |
| 4729965 | Method of forming extrinsic base by diffusion from polysilicon/silicide source and emitter by lithography | Kazuhiko Sagara, Norio Hasegawa, Shinji Okazaki, Toshihiko Takakura, Hirotaka Nishizawa | 1988-03-08 |
| 4635090 | Tapered groove IC isolation | Tokuo Kure, Akira Sato, Hisayuki Higuchi | 1987-01-06 |
| 4396460 | Method of forming groove isolation in a semiconductor device | Tokuo Kure, Takeo Shiba, Hisayuki Higuchi | 1983-08-02 |