| 12363927 |
Wide gap semiconductor device |
Yusuke Maeyama, Shunichi Nakamura |
2025-07-15 |
| 7141741 |
Circuit board |
Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima +12 more |
2006-11-28 |
| 6434008 |
Semiconductor device |
Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima +12 more |
2002-08-13 |
| 6353258 |
Semiconductor module |
Hirokazu Inoue, Ryuichi Saito, Mutsuhiro Mori, Yasutoshi Kurihara, Shin Kimura +6 more |
2002-03-05 |
| 6225598 |
Method of high frequency pulse arc welding and apparatus therefor |
Masayasu Nihei, Takao Funamoto, Izumi Sakurai, Akira Onuma |
2001-05-01 |
| 5956231 |
Semiconductor device having power semiconductor elements |
Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima +12 more |
1999-09-21 |
| 5767577 |
Method of solder bonding and power semiconductor device manufactured by the method |
Masayasu Nihei, Toshiaki Morita |
1998-06-16 |
| 5539244 |
Power semiconductor device |
Mutsuhiro Mori, Yasumichi Yasuda, Hiroyuki Ozawa |
1996-07-23 |
| 5175608 |
Method of and apparatus for sputtering, and integrated circuit device |
Masayasu Nihei, Yasushi Koubuchi, Kunio Miyazaki, Tatsuo Itagaki |
1992-12-29 |
| 5153704 |
Semiconductor device using annealed bonding wire |
Masateru Suwa, Masahiro Koizumi, Tomio Iizuka, Takeo Tamamura |
1992-10-06 |
| 5051812 |
Semiconductor device and method for manufacturing the same |
Masayasu Nihei, Yasushi Koubuchi, Motoo Suwa, Shinichi Fukada, Katsuhiko Shiota +3 more |
1991-09-24 |
| 5019891 |
Semiconductor device and method of fabricating the same |
Yasushi Koubuchi, Shinichi Fukada, Katuhiko Shiota, Kunio Miyazaki, Tatsuo Itagaki +1 more |
1991-05-28 |
| 4999096 |
Method of and apparatus for sputtering |
Masayasu Nihei, Yasushi Koubuchi, Kunio Miyazaki, Tatsuo Itagaki |
1991-03-12 |
| 4976393 |
Semiconductor device and production process thereof, as well as wire bonding device used therefor |
Makoto Nakajima, Yoshio Ohashi, Toshio Chuma, Kazuo Hatori, Isao Araki +3 more |
1990-12-11 |
| 4965656 |
Semiconductor device |
Yasushi Koubuchi, Masahiro Koizumi |
1990-10-23 |
| 4912544 |
Corrosion-resistant aluminum electronic material |
Masateru Suwa, Masahiro Koizumi, Osamu Asai, Katsumi Suzuki, Ryo Hiraga |
1990-03-27 |
| 4542398 |
Semiconductor devices of multi-emitter type |
Tsutomu Yatsuo, Masayoshi Naito, Takahiro Nagano, Tomio Yasuda, Mitsuo Yanagi +1 more |
1985-09-17 |
| 4500904 |
Semiconductor device |
Ko Soeno, Keiichi Morita, Hisakithi Onodera |
1985-02-19 |
| 4482912 |
Stacked structure having matrix-fibered composite layers and a metal layer |
Akio Chiba, Seiki Shimizu, Keiichi Kuniya |
1984-11-13 |
| 4246693 |
Method of fabricating semiconductor device by bonding together silicon substrate and electrode or the like with aluminum |
Ko Soeno, Masateru Suwa, Hisakichi Onodera |
1981-01-27 |