WF

Wai B. Fu

HG HGST: 1 patents #1,032 of 1,677Top 65%
📍 Menlo Park, CA: #2,703 of 3,774 inventorsTop 75%
🗺 California: #247,236 of 386,348 inventorsTop 65%
Overall (All Time): #3,245,152 of 4,157,543Top 80%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7914657 Controlling the thickness of wafers during the electroplating process Hieu Lam, Shahram Y. Mehdizadeh, Yeak-Chong Wong 2011-03-29