MM

Michael M. Morrow

HP HP: 2 patents #5,870 of 16,619Top 40%
CM Cmc Materials: 1 patents #33 of 67Top 50%
📍 Corvallis, OR: #690 of 1,763 inventorsTop 40%
🗺 Oregon: #10,188 of 28,073 inventorsTop 40%
Overall (All Time): #1,402,717 of 4,157,543Top 35%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11802220 Silica-based slurry for selective polishing of carbon-based films Brian Reiss, Fernando HUNG LOW, Helin Huang 2023-10-31
9056470 Flexible circuit seal Jay Holavarri, Daniel W. Petersen 2015-06-16
8590742 Fluid supply contact John A. Devos 2013-11-26