Issued Patents All Time
Showing 176–184 of 184 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7218004 | Fusing nanowires using in situ crystal growth | Alfred I-Tsung Pan, Yoocharn Jeon, Scott Haubrich | 2007-05-15 |
| 7217650 | Metallic nanowire interconnections for integrated circuit fabrication | Jun Li, Meyya Meyyappan | 2007-05-15 |
| 6696761 | Method to encapsulate copper plug for interconnect metallization | Lap Chan, Sam Fong Yau Li | 2004-02-24 |
| 6660636 | Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating | Sam Fong Yau Li | 2003-12-09 |
| 6495200 | Method to deposit a seeding layer for electroless copper plating | Lap Chan, Fong Yau Sam Li | 2002-12-17 |
| 6281117 | Method to form uniform silicide features | Lap Chan, Chaw Sing Ho, Fong Yau Sam Li | 2001-08-28 |
| 6214728 | Method to encapsulate copper plug for interconnect metallization | Lap Chan, Sam Fong Yau Li | 2001-04-10 |
| 6181097 | High precision three-dimensional alignment system for lithography, fabrication and inspection | Sam Fong Yau Li | 2001-01-30 |
| 6136693 | Method for planarized interconnect vias using electroless plating and CMP | Lap Chan | 2000-10-24 |