Issued Patents All Time
Showing 251–275 of 336 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7732902 | Semiconductor package with getter formed over an irregular structure | James McKinnell, Kenneth Diest, Kenneth M. Kramer, Daniel A. Kearl | 2010-06-08 |
| 7723811 | Packaged MEMS device assembly | Charles C. Haluzak, Jeffrey R. Pollard, Kirby Sand, John R. Sterner, Henry Kang +1 more | 2010-05-25 |
| 7692403 | Power control apparatus | Chih-Tarng Chuang, Jeng-Jye Wu, Shih-Chin Lu, Li-Jen Lee | 2010-04-06 |
| 7682934 | Wafer packaging and singulation method | Steven R Geissler | 2010-03-23 |
| 7633570 | Liquid crystal display with uniform feed-through voltage | Chih-Yuan Chien, Chen-Kuo Yang, Hsuen-Ying Huang | 2009-12-15 |
| 7619535 | Power monitoring apparatus of fan | Wen-Shi Huang | 2009-11-17 |
| 7611919 | Bonding interface for micro-device packaging | Kirby Sand, Charles C. Haluzak | 2009-11-03 |
| 7609067 | Electronic portion of an ion gauge with ion collectors bowed out of plane to form a three dimensional arrangement | James McKinnell | 2009-10-27 |
| 7596095 | Network device test system and method for testing network device | Han-Tzung Lin | 2009-09-29 |
| 7576439 | Electrically connecting substrate with electrical device | David Craig | 2009-08-18 |
| 7563691 | Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding | Barry C. Snyder, Ronald A. Hellekson | 2009-07-21 |
| 7549225 | Method of forming a printhead | Charles C. Haluzak | 2009-06-23 |
| 7541209 | Method of forming a device package having edge interconnect pad | Charles C. Haluzak, David Craig | 2009-06-02 |
| 7534662 | Methods for hermetic sealing of post media-filled MEMS package | Charles C. Haluzak, Donald L. Michael | 2009-05-19 |
| 7508132 | Device having a getter structure and a photomask | James McKinnell, John Liebeskind | 2009-03-24 |
| 7494593 | Method for forming a cantilever and tip | John Chen, Sriram Ramamoorthi | 2009-02-24 |
| 7482682 | Micro-device packaging | Henry Kang, Bradley John | 2009-01-27 |
| 7476608 | Electrically connecting substrate with electrical device | David Craig | 2009-01-13 |
| 7470557 | Self-aligned coating on released MEMS | Bradley John, Mike Groh | 2008-12-30 |
| 7443001 | Preparation of microelectromechanical system device using an anti-stiction material and selective plasma sputtering | Paul F. Reboa, Charles C. Haluzak | 2008-10-28 |
| 7442576 | Placement of absorbing material in a semiconductor device | David M. Crald, Troy D. Schwinabart | 2008-10-28 |
| 7436571 | Micro-displays | John R. Sterner, Charles C. Haluzak, William Boucher, Scott Lerner, James W. Ring +3 more | 2008-10-14 |
| 7422962 | Method of singulating electronic devices | Zhizhang Chen, Steven R Geissler | 2008-09-09 |
| 7417307 | System and method for direct-bonding of substrates | Charles C. Haluzak, Arthur Piehl, Jennifer Shih | 2008-08-26 |
| 7382512 | Resistivity phase change material | Zhizhang Chen, Qin Liu, Timothy F. Myers | 2008-06-03 |