Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8390111 | Wafer bonding method | — | 2013-03-05 |
| 8043880 | Microelectronic device | Charles C. Haluzak, John R. Sterner | 2011-10-25 |
| 8007078 | Microfluidic device and a fluid ejection device incorporating the same | Charles C. Haluzak, Chien-Hua Chen | 2011-08-30 |
| 7988264 | Method for forming a fluid ejection device | Charles C. Haluzak, Chien-Hua Chen | 2011-08-02 |
| 7828417 | Microfluidic device and a fluid ejection device incorporating the same | Charles C. Haluzak, Chien-Hua Chen | 2010-11-09 |
| 7766462 | Method for forming a fluid ejection device | Charles C. Haluzak, Chien-Hua Chen | 2010-08-03 |
| 7723811 | Packaged MEMS device assembly | Charles C. Haluzak, Jeffrey R. Pollard, John R. Sterner, Henry Kang, Chien-Hua Chen +1 more | 2010-05-25 |
| 7618682 | Method for providing an anti-stiction coating on a metal surface | Paul F. Reboa | 2009-11-17 |
| 7611919 | Bonding interface for micro-device packaging | Charles C. Haluzak, Chien-Hua Chen | 2009-11-03 |
| 7320899 | Micro-displays and their manufacture | Charles C. Haluzak, Kenneth Faase, John R. Sterner, Chien-Hua Chen, Bao Yeh +1 more | 2008-01-22 |
| 7303976 | Wafer bonding method | — | 2007-12-04 |
| 6858466 | System and a method for fluid filling wafer level packages | Bradley A. Bower, Quan Qi | 2005-02-22 |