Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8858742 | Automatic monitoring of vibration welding equipment | John Patrick Spicer, Debejyo Chakraborty, Michael Anthony Wincek, Hui Wang, Jeffrey A. Abell +1 more | 2014-10-14 |
| 8702882 | Method and system for online quality monitoring and control of a vibration welding process | Jeffrey A. Abell, Jason C. H. Tang, Michael Anthony Wincek, Paul J. Boor, Paul F. Spacher +1 more | 2014-04-22 |
| 8672211 | Vibration welding system with thin film sensor | Jeffrey A. Abell, Xiaochun Li, Hang Li, Hongseok Choi, Jingzhou Zhao | 2014-03-18 |
| 8563160 | Interconnect member for a battery module | Susan M. Smyth, Robert S. Bucchi | 2013-10-22 |
| 8535395 | Beam welding of a multi-sheet work stack having a reduced thickness feature | Thomas B. Stoughton, David Yang, Xiang Zhao | 2013-09-17 |
| 8450644 | Multi-mode ultrasonic welding control and optimization | Jason C. H. Tang | 2013-05-28 |
| 8444039 | Thermally-insulated vibration welding tool | Paul F. Spacher, Edgar M. Storm, Xingcheng Xiao, Susan M. Smyth | 2013-05-21 |
| 8409383 | Passively damped vibration welding system and method | Chin-An Tan, Bongsu Kang, Tao Wu | 2013-04-02 |
| 8408445 | Actively controlled vibration welding system and method | Bongsu Kang, Chin-An Tan | 2013-04-02 |
| 8114242 | Dimension-set method for joining parts | Paul J. Tyckoski, Tao Xie | 2012-02-14 |
| 8032343 | Method of optimizing weld design for concurrent consideration of performance and manufacturing requirements | Robert Bruce Tilove, Gopalakrishna Shastry | 2011-10-04 |
| 8011559 | Active material-augmented vibration welding system and method of use | Xiujie Gao, Nancy L. Johnson, Alan L. Browne | 2011-09-06 |
| 7810699 | Method and system for optimized vibration welding | Alexander D. Khakhalev, Roland J. Menassa | 2010-10-12 |
| 7290423 | Roller hemming apparatus and method | John E. Carsley, Gary A. Kruger, Paul E. Krajewski, Yang-Tse Cheng | 2007-11-06 |
| 7091134 | Deposition of integrated circuit fabrication materials using a print head | Henner Meinhold, Mark L. Rea, Sachin M. Chinchwadkar | 2006-08-15 |