Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522679 | Selective shallow trench isolation (STI) fill for stress engineering in semiconductor structures | Ashish Jha, Hong Yu, Xinyuan Dou, Xusheng Wu, Dongil Choi +1 more | 2019-12-31 |