Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10199342 | Reliable pad interconnects | Xinfu Liu, Yoke Leng Lim, Siow Lee Chwa | 2019-02-05 |
| 9859236 | Integrated circuits having copper bonding structures with silicon carbon nitride passivation layers thereon and methods for fabricating same | Meng Meng Chong, Xuesong Rao, Chim Seng Seet | 2018-01-02 |