Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9859236 | Integrated circuits having copper bonding structures with silicon carbon nitride passivation layers thereon and methods for fabricating same | Xuesong Rao, Chim Seng Seet, Xiaohua Zhan | 2018-01-02 |
| 9293388 | Reliable passivation layers for semiconductor devices | Xuesong Rao, Chim Seng Seet, Hendro Mario, Aison John George, Chor Shu CHENG | 2016-03-22 |