RS

Richard Joseph Saia

GE: 62 patents #146 of 36,430Top 1%
LM Lockheed Martin: 2 patents #1,600 of 6,507Top 25%
UF US Air Force: 1 patents #6,190 of 16,312Top 40%
📍 Niskayuna, NY: #37 of 949 inventorsTop 4%
🗺 New York: #1,217 of 115,490 inventorsTop 2%
Overall (All Time): #33,841 of 4,157,543Top 1%
65
Patents All Time

Issued Patents All Time

Showing 51–65 of 65 patents

Patent #TitleCo-InventorsDate
5374792 Micromechanical moving structures including multiple contact switching system Mario Ghezzo, Bharat S. Bagepalli, Imdad Imam, Dennis L. Polla 1994-12-20
5370972 Amorphous silicon photodiode with sloped sidewalls and method of fabrication Robert F. Kwasnick, Brian W. Giambattista 1994-12-06
5367585 Integrated microelectromechanical polymeric photonic switch Mario Ghezzo, Christopher P. Yakymyshyn, Dennis L. Polla 1994-11-22
5362660 Method of making a thin film transistor structure with improved source/drain contacts Robert F. Kwasnick, George E. Possin, David E. Holden 1994-11-08
5318664 Patterning of indium-tin oxide via selective reactive ion etching Robert F. Kwasnick, Ching-Yeu Wei 1994-06-07
5302547 Systems for patterning dielectrics by laser ablation Robert J. Wojnarowski, Herbert S. Cole, Jr., Thomas Bert Gorczyca, Ernest Wayne Balch 1994-04-12
5285571 Method for extending an electrical conductor over an edge of an HDI substrate Thomas Bert Gorczyca, Paul Alan McConnelee 1994-02-15
5198694 Thin film transistor structure with improved source/drain contacts Robert F. Kwasnick, George E. Possin, David E. Holden 1993-03-30
5191394 Amorphous silicon photodiode with sloped sidewalls and method of fabrication Robert F. Kwasnick, Brian W. Giambattista 1993-03-02
5187369 High sensitivity, high resolution, solid state x-ray imaging device with barrier layer Jack D. Kingsley, Robert F. Kwasnick, Ching-Yeu Wei 1993-02-16
4871617 Ohmic contacts and interconnects to silicon and method of making same Manjin J. Kim, Dale M. Brown, Simon S. Cohen, Bernard Gorowitz 1989-10-03
4845050 Method of making mo/tiw or w/tiw ohmic contacts to silicon Manjin J. Kim, Dale M. Brown, Simon S. Cohen, Bernard Gorowitz 1989-07-04
4824802 Method of filling interlevel dielectric via or contact holes in multilevel VLSI metallization structures Dale M. Brown, Bernard Gorowitz 1989-04-25
4522681 Method for tapered dry etching Bernard Gorowitz 1985-06-11
4444618 Processes and gas mixtures for the reactive ion etching of aluminum and aluminum alloys Bernard Gorowitz 1984-04-24