Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11306225 | Electrically conductive adhesive agent composition, and electrically conductive adhesive film and dicing-die-bonding film using the same | Naoaki Mihara, Jirou Sugiyama | 2022-04-19 |
| 10670335 | Method and apparatus for manufacturing enameled wire | Yasuhiro Funayama, Ken OMORI | 2020-06-02 |
| 7689968 | Proximity effect correction with regard to a semiconductor circuit design pattern | — | 2010-03-30 |
| 6440828 | Process of fabricating semiconductor device having low-resistive contact without high temperature heat treatment | Toshiki Shinmura, Yoshiaki Yamada, Tetsuya Taguwa, Koji Urabe | 2002-08-27 |