Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7308999 | Die bonding apparatus | Toshihiko Fujii, Takashi Ohta, Shinichi Sugiura, Katsufumi Morimune | 2007-12-18 |
| 6708862 | Die bonding apparatus | Toshihiko Fujii, Takashi Ohta, Shinichi Sugiura, Katsufumi Morimune | 2004-03-23 |