Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8190378 | Crack growth evaluation apparatus, crack growth evaluation method, and recording medium recording crack growth evaluation program | Hidehisa Sakai, Masanori Motegi, Tsutomu Iikawa | 2012-05-29 |
| 7308999 | Die bonding apparatus | Toshihiko Fujii, Takashi Ohta, Shinichi Sugiura, Toshimasa Akamatsu | 2007-12-18 |
| 7120024 | Electronic control device | Hiromichi Watanabe, Shinichi Sugiura, Takafumi Yasuhara, Hideaki Kaino, Nobuhiro Wada +1 more | 2006-10-10 |
| 6708862 | Die bonding apparatus | Toshihiko Fujii, Takashi Ohta, Shinichi Sugiura, Toshimasa Akamatsu | 2004-03-23 |