Issued Patents All Time
Showing 26–50 of 96 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8405204 | Semiconductor package with package main body cooling structure using coolant, and semiconductor package assembly with the semiconductor package and coolant circulating structure | — | 2013-03-26 |
| 8391391 | Wireless communication apparatus and wireless communication controlling method | — | 2013-03-05 |
| 8379690 | Wireless receiver, wireless communication system, and wireless communication method | — | 2013-02-19 |
| 8363691 | Pilot multiplexing method and OFDM transceiver apparatus in OFDM system | Masahiko Shimizu | 2013-01-29 |
| 8333882 | Polishing apparatus and method of polishing work | Unkai Sato, Koichiro Ichikawa, Yoshinobu Nishimoto, Yoshio Nakamura, Masumi Iihama | 2012-12-18 |
| 8320154 | Switching element and application of the same | Masakazu Aono, Fumiko Yano, Kazuya Terabe, Toru Tsuruoka, Tomoko Ebihara +3 more | 2012-11-27 |
| 8283681 | Lighting device and method of manufacturing the same | Noriaki Sakamoto, Naoki Tanahashi, Takaya Kusabe, Masahiko Mizutani, Hideki Mizuhara +1 more | 2012-10-09 |
| 8265131 | Control apparatus for and control method of equalizer, and wireless terminal having that control apparatus | Akira Ito | 2012-09-11 |
| 8208589 | Receiver and reception processing method | — | 2012-06-26 |
| 8049316 | Semiconductor package | — | 2011-11-01 |
| 8029916 | Brazing filler metal, brazing composite material and brazed structure brazed/bonded with the same | Masaaki Ishio, Yoshimitsu Oda | 2011-10-04 |
| 8029918 | Brazing method and brazed structure | Masaaki Ishio, Shunji Kajikawa, Yoshitsugu Sakamoto, Takayuki Hayashi | 2011-10-04 |
| 8012612 | Interlayer for laminated glass and laminated glass | — | 2011-09-06 |
| 7953141 | Interference reduction receiver | Masahiko Shimizu | 2011-05-31 |
| 7911794 | Semiconductor package | — | 2011-03-22 |
| 7875883 | Electric device using solid electrolyte | Toshitsugu Sakamoto, Masakazu Aono, Tomonobu Nakayama, Kazuya Terabe, Hisao Kawaura +1 more | 2011-01-25 |
| 7868450 | Semiconductor package | Seiji Ito | 2011-01-11 |
| 7776452 | Heat sink member and method of manufacturing the same | Kazuhiro Shiomi, Masaaki Ishio | 2010-08-17 |
| 7763315 | Process for preparing a metal coating material comprising condensation polymerized resin nanoparticles | Masao Yamazaki, Yoshiyuki Asai, Yoichi Kitamura | 2010-07-27 |
| 7750332 | Solid electrolyte switching device, FPGA using same, memory device, and method for manufacturing solid electrolyte switching device | Toshitsugu Sakamoto, Masakazu Aono, Tomonobu Nakayama, Hiroshi Sunamura, Hisao Kawaura +1 more | 2010-07-06 |
| 7745928 | Heat dissipation plate and semiconductor device | — | 2010-06-29 |
| 7746938 | Pilot multiplexing method and OFDM receiving method in OFDM system | Akira Ito | 2010-06-29 |
| 7733942 | Interference reduction receiving device and method thereof | — | 2010-06-08 |
| 7732916 | Semiconductor package | — | 2010-06-08 |
| 7732042 | Laminated glass and interlayer film for laminated glasses | Juichi Fukatani, Toshio Tada, Masaki Matsudo | 2010-06-08 |