Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9966295 | Temporary bonding laminates for use in manufacture of semiconductor devices and method for manufacturing semiconductor devices | Yu Iwai, Kazuhiro Fujimaki | 2018-05-08 |
| 9929376 | Laminate, kit for manufacturing organic semiconductor, and resist composition for manufacturing organic semiconductor | Kazuyoshi Mizutani, Yu Iwai, Yoshitaka Kamochi | 2018-03-27 |
| 9746771 | Laminate body | Yoshitaka Kamochi, Yu Iwai, Atsushi Nakamura | 2017-08-29 |
| 9716024 | Temporary bonding laminates for used in manufacture of semiconductor devices | Yu Iwai | 2017-07-25 |
| 9716025 | Temporary bonding laminates for use in manufacture of semiconductor devices | Yu Iwai, Masafumi Yoshida | 2017-07-25 |
| 9505953 | Temporary adhesive for production of semiconductor device, and adhesive support and production method of semiconductor device using the same | Yu Iwai, Kazuhiro Fujimaki | 2016-11-29 |
| 9348225 | Lithographic printing plate precursors and processes for preparing lithographic printing plates | Junya ABE | 2016-05-24 |
| 9177921 | Manufacturing method of semiconductor device | Shiro Tan, Kazuhiro Fujimaki, Yu Iwai, Atsushi Nakamura | 2015-11-03 |
| 8722931 | Compound and method for preparing the same | Yu Iwai, Takafumi Nakayama, Junya ABE | 2014-05-13 |