Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833272 | Laminate and kit | Seiya Masuda, Atsushi Nakamura | 2020-11-10 |
| 10580640 | Kit and laminate | Yu Iwai, Ichiro KOYAMA, Atsushi Nakamura | 2020-03-03 |
| 10442961 | Composition, process for producing sheet, sheet, laminate, and laminate with device wafer | Ichiro KOYAMA, Yu Iwai, Atsushi Nakamura, Mitsuru Sawano | 2019-10-15 |
| 10414951 | Temporary bonding material, laminate, method for manufacturing laminate, method for manufacturing device substrate, and method for manufacturing semiconductor device | Kei FUKUHARA, Mitsuru Sawano | 2019-09-17 |
| 10287458 | Laminate for treatment of a wafer device, temporary adhesion composition, and temporary adhesion film | Yu Iwai, Mitsuru Sawano, Ichiro KOYAMA, Atsushi Nakamura | 2019-05-14 |
| 9929376 | Laminate, kit for manufacturing organic semiconductor, and resist composition for manufacturing organic semiconductor | Kazuyoshi Mizutani, Yu Iwai, Ichiro KOYAMA | 2018-03-27 |
| 9746771 | Laminate body | Ichiro KOYAMA, Yu Iwai, Atsushi Nakamura | 2017-08-29 |
| 9601706 | Resin composition for forming protective film, protective film, pattern forming method, method for manufacturing electronic device, and electronic device | Yu Iwai, Atsushi Nakamura, Masafumi Yoshida | 2017-03-21 |