Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9221131 | Solder alloy | Anthony E. Ingham, Gerard Campbell, Brian G. Lewis, Bawa Singh, Ranjit Pandher | 2015-12-29 |
| 8641964 | Solder alloy | Brian G. Lewis, Bawa Singh, Ranjit Pandher | 2014-02-04 |
| 8191757 | Reducing joint embrittlement in lead-free soldering processes | Brian G. Lewis, Bawa Singh, Ranjit Pandher | 2012-06-05 |
| 7663242 | Thermal interface material and solder preforms | Brian G. Lewis, Bawa Singh, David Kyaw, Anthony E. Ingham, Attiganal Narayanaswamy Sreeram +3 more | 2010-02-16 |
| 7187083 | Thermal interface material and solder preforms | Brian G. Lewis, Bawa Singh, David Kyaw, Anthony E. Ingham, Attiganal Narayanaswamy Sreeram +3 more | 2007-03-06 |