Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7663242 | Thermal interface material and solder preforms | Brian G. Lewis, Bawa Singh, John P. Laughlin, Anthony E. Ingham, Attiganal Narayanaswamy Sreeram +3 more | 2010-02-16 |
| 7187083 | Thermal interface material and solder preforms | Brian G. Lewis, Bawa Singh, John P. Laughlin, Anthony E. Ingham, Attiganal Narayanaswamy Sreeram +3 more | 2007-03-06 |