Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9221131 | Solder alloy | Gerard Campbell, Brian G. Lewis, Bawa Singh, John P. Laughlin, Ranjit Pandher | 2015-12-29 |
| 7663242 | Thermal interface material and solder preforms | Brian G. Lewis, Bawa Singh, John P. Laughlin, David Kyaw, Attiganal Narayanaswamy Sreeram +3 more | 2010-02-16 |
| 7187083 | Thermal interface material and solder preforms | Brian G. Lewis, Bawa Singh, John P. Laughlin, David Kyaw, Attiganal Narayanaswamy Sreeram +3 more | 2007-03-06 |
| 5382299 | Soldering flux | Dosten Baluch | 1995-01-17 |