Issued Patents All Time
Showing 151–175 of 175 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6029344 | Composite interconnection element for microelectronic components, and method of making same | Igor Y. Khandros | 2000-02-29 |
| 6020220 | Compliant semiconductor chip assemblies and methods of making same | Kenneth B. Gilleo, Gary W. Grube | 2000-02-01 |
| 5998228 | Method of testing semiconductor | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros | 1999-12-07 |
| 5994152 | Fabricating interconnects and tips using sacrificial substrates | Igor Y. Khandros, Benjamin N. Eldridge | 1999-11-30 |
| 5983493 | Method of temporarily, then permanently, connecting to a semiconductor device | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros | 1999-11-16 |
| 5974662 | Method of planarizing tips of probe elements of a probe card assembly | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros | 1999-11-02 |
| 5926951 | Method of stacking electronic components | Igor Y. Khandros | 1999-07-27 |
| 5915752 | Method of making connections to a semiconductor chip assembly | Thomas H. DiStefano, Gary W. Grube, Igor Y. Khandros, Jason Sweis, Laurie Union +1 more | 1999-06-29 |
| 5917707 | Flexible contact structure with an electrically conductive shell | Igor Y. Khandros | 1999-06-29 |
| 5912046 | Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component | Benjamin N. Eldridge, Igor Y. Khandros | 1999-06-15 |
| 5897326 | Method of exercising semiconductor devices | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros | 1999-04-27 |
| 5884398 | Mounting spring elements on semiconductor devices | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros | 1999-03-23 |
| 5878486 | Method of burning-in semiconductor devices | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros | 1999-03-09 |
| 5864946 | Method of making contact tip structures | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros | 1999-02-02 |
| 5832601 | Method of making temporary connections between electronic components | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros | 1998-11-10 |
| 5829128 | Method of mounting resilient contact structures to semiconductor devices | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros | 1998-11-03 |
| 5806181 | Contact carriers (tiles) for populating larger substrates with spring contacts | Igor Y. Khandros, Benjamin N. Eldridge, Thomas H. Dozier, II, William D. Smith | 1998-09-15 |
| 5773780 | Method of severing bond wires and forming balls at their ends | Benjamin N. Eldridge | 1998-06-30 |
| 5772451 | Sockets for electronic components and methods of connecting to electronic components | Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros | 1998-06-30 |
| 5601740 | Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires | Benjamin N. Eldridge | 1997-02-11 |
| 5525545 | Semiconductor chip assemblies and components with pressure contact | Gary W. Grube, Igor Y. Khandros | 1996-06-11 |
| 5414298 | Semiconductor chip assemblies and components with pressure contact | Gary W. Grube, Igor Y. Khandros | 1995-05-09 |
| 5398863 | Shaped lead structure and method | Gary W. Grube, Jason Sweis, John Grange | 1995-03-21 |
| 5173621 | Transceiver with isolated power rails for ground bounce reduction | Dana Fraser, Ray A. Mentzer, Jerry D. Gray, Geoff Hannington, Susan M. Keown | 1992-12-22 |
| 5065224 | Low noise integrated circuit and leadframe | Dana Fraser, Ray A. Mentzer, Jerry D. Gray, Geoff Hannington, Susan M. Keown | 1991-11-12 |